Measuring the position of passively aligned optical components

ABSTRACT

Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/392,018, filed on Mar. 29, 2006, which is a divisional of U.S. patentapplication Ser. No. 11/174,940, filed on Jul. 5, 2005, now U.S. Pat.No. 7,050,682, which is a divisional of U.S. patent application Ser. No.10/609,804, filed on Jun. 30, 2003, which issued as U.S. Pat. No.6,959,134.

BACKGROUND

This invention relates generally to the assembly of components foroptical communication networks.

In optical networks, a number of components may be placed on astructure, such as an optical bench or a planar lightwave circuit. It isadvantageous to precisely position these structures using high precisionflip chip bonders. However, such bonders are only able to providealignment in the X and Z coordinates, which basically exist in a planecorresponding to the plane of the optical bench or the planar lightwavecircuit.

These bonders do not control the positioning in the transverse or Ydirection normal to the surface of the bench or circuit. Unfortunately,optical coupling efficiency between components is also highly dependenton the Y-height placement. However, the present inventors know of nomethodology or tooling to address the Y-height placement aspect.

Thus, there is a need for better ways to provide alignment operationsfor building passive optical devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an enlarged, cross-sectional view of one embodiment of thepresent invention;

FIG. 2 is a schematic depiction of the embodiment shown in FIG. 1;

FIG. 3 is an enlarged, cross-sectional depiction of another embodimentof the present invention;

FIG. 4 is a schematic depiction of the embodiment shown in FIG. 3;

FIG. 5 is an enlarged, cross-sectional view of still another embodimentof the present invention;

FIG. 6 is a schematic depiction of the embodiment shown in FIG. 5; and

FIG. 7 is a schematic depiction of another embodiment.

DETAILED DESCRIPTION

Referring to FIG. 1, an optical amplifier 14 may be positioned on asilicon optical bench or planar lightwave circuit 12 in one embodimentof the present invention. The bench 12 may be L-shaped in cross sectionin one embodiment of the present invention. The bench 12 and the opticalamplifier 14 may each have a part 16 a, 16 b of a waveguide 16 thatultimately needs to be aligned. Thus, it is desirable to use a highprecision flip chip bonder or other chip placement tool to position theamplifier 14 precisely on the bench 12 so that the portion 16 a of thewaveguide lines up with the portion 16 b of the waveguide on theseparate bench 12 and amplifier 14.

Though the present description speaks of amplifiers and benches, thepresent invention is applicable to aligning and positioning any opticalcomponent with respect to any other optical component. Thus, thediscussion of optical amplifiers and benches is merely meant as anillustrative example.

The amplifier 14 may have a bonding pad 18 including a plurality ofportions 18 a-18 d. Each of the portions 18 a-18 d may be a distinctportion that extends downwardly from the amplifier 14 and is separatedfrom adjacent portions in one embodiment.

Conversely, on the bench 12, a plurality of bonding pads 20 a-20 d maybe provided which extend upwardly and which are distinct and separatefrom their respective neighbors in one embodiment. In one embodiment,the bonding pads 20 and the bonding pads 18 are made of the samematerial, such as gold. However, the bonding pads 20 a-20 d have astepped configuration such that the height of the pads 20 a is higherthan the pads 20 b, which is higher than the pads 20 c, which is higherthan the pads 20 d.

Thus, when the amplifier 14 is lowered onto the bench 12, one or more ofthe pads 18 makes physical contact with one or more of the pads 20.However, as shown in FIG. 1, there is no contact between any of the pads18 or any of the pads 20 since the amplifier 14 and bench 12 are beingpositioned in the Y direction. The physical contact between particularpads 18 and 20 may also close an electrical switch 21 whose contacts areformed by the pads 18 and 20.

Thus, referring to FIG. 2, the pads 18 and 20 form a plurality ofswitches 21 (which are closed when the pads 18 make contact with theiraligned pads 20). The switches 21 are shown in their open positionbecause no contact has been established between pads 18 and 20 inFIG. 1. The switches 21 a-21 d in FIG. 2 are coupled to a contact 22a-22 d. The contact 22 may be probed by a probing tool or other deviceto determine whether or not the switches 21 are open or closed.

Depending on which switches 21 are closed, the precise Y dimensionorientation of the amplifier 14 and the bench 12, relative to oneanother, can be determined. In particular, since each pad 20 may have adifferent height in one embodiment, closure of any switch 21 indicates arelative spacing between the amplifier 14 and bench 12.

For example, referring to FIG. 3, the pad 18 a has now made contact withthe pad 20 a, as indicated at B. Thus, referring to FIG. 4, the switch21 a is closed, but the other switches 21 remain open. As indicated atA′, the waveguide portions 16 a and 16 b are still not preciselyaligned.

Referring to FIG. 5, after further displacement in the Y dimension, thepad 18 b now also contacts the pad 20 b, as shown in B′. To achieve thisresult, the pad 18 a may be deformed in one embodiment. In thisposition, the waveguide portions 16 a and 16 b are precisely aligned asshown at A″. Here, the switches 21 b and 21 a are both closed and theswitches 21 c and 21 d are both open as shown in FIG. 6. Thus, theprecise relative positions in the Y dimension can be determined to anydesired granularity. More or fewer switches 21 may be provided toachieve the desired results, with variations in their heights in unitsof 0.2 nm, for example, or any other value such as 0.05 nm or 0.5 nm asdesired for the particular application.

The flip chip bonder has precise alignment in the X and Z coordinates.Through the provision of the switches 21, precise alignment can beobtained in the Y direction. Therefore, the precise positioning of theparts is possible on a real time basis in some embodiments of thepresent invention. Rapid, nondestructive screening and sorting may alsobe accomplished using for example a prober to determine the resistanceof the switches after the bonding step has been completed.

In some embodiments, the switches 21 may be fabricated during waferprocessing using combinations of masking and etching, dry or wet, andthe same process steps as deposition, via etch, and the like. Resolutionof the switches 21 may be defined by the thicknesses of the respectivepads 18, 20. Since the pads 18 and 20 define the switches 21, a materialto facilitate electrical contact (such as gold) may be provided on thefacing surfaces of the pads 18 and 20.

During the bonding process, a metal on the amplifier 14 side may deformor shrink to enable bond establishment between the amplifier 14 andbench 12. The deformation stops when the bonding force is withdrawn.This action facilitates the connection of the bond pad 18 on theamplifier 14, connecting or shorting the switches 21 at different stepheights. Depending on the degree of deformation or transformation of thepads 18 on the amplifier 14, more or fewer contacts may be closed. Bymeasuring the resistance of the switches 21 after bonding, one candetermine the distance (and/or deformation) in the Y dimension of theamplifier 14 relative to the bench 12.

The construction of the switches 21 can be reversed depending on theoverall process sequence. Pads of different heights may be fabricated onthe amplifier 14 and the mating pads may be provided on the bench 12 inanother embodiment. The concept of the switches 21 can be extended tochecking other critical bonding factors which determine couplingefficiency, such as bonding integrity, tilt angle, and rotation angle.

The Y-height can be determined immediately after bonding by checking theswitches 21 using wafer probing. In cases where the bench is a wafer andmultiple components are aligned using this method, the prober mayprovide a wafer map for sorting and the wafer map may reduce the cost oftesting for bad bench/amplifier combinations 10, translating to lowercost of the overall product in some embodiments. With a continuity meteror prober communicating with the bonder, besides the X and Zcoordinates, the real time Y-height bonding data can be fed back to thebonder for real time control. The feedback may facilitate the opticalpassive alignment and high volume production and, therefore, may furtherreduce manufacturing costs.

Referring to FIG. 7, the amplifier 14 and bench 12 may be represented byintegrated switches 21. Those switches 21 sense the distance between theamplifier 14 and the bench 12. That information may be read out by awafer prober or continuity tester 26 using the contacts 22. Theinformation about what switches 21 are open and closed may then beconverted into a relative position in the Y direction. That informationmay then be provided by the prober 26 back to the bonder 24. The bonder24 may then appropriately position the amplifier 14 and bench 12 basedon the desired orientation.

While the present invention has been described with respect to a limitednumber of embodiments, those skilled in the art will appreciate numerousmodifications and variations therefrom. It is intended that the appendedclaims cover all such modifications and variations as fall within thetrue spirit and scope of this present invention.

1. An optical component comprising: a body; and a stepped contactsurface on said body.
 2. The component of claim 1 wherein said steppedcontact surface includes electrical contacts.
 3. The component of claim2 wherein said contacts are aligned to couple to contacts on anothercomponent to complete an electrical circuit.
 4. The component of claim 3wherein said contacts are formed of gold.
 5. The component of claim 2wherein said stepped contact surface includes a plurality of upstandingsteps, at least one of which is physically deformable and each of whichincludes an electrical contact.